NETZSCH - Leading Thermal Analysis.
 

 LECTURE SERIES

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ADVANCED THERMAL ANALYSIS
THERMOPHYSICAL PROPERTIES SEMINAR SERIES
2010 Lecture Series

 

Powerful, info-packed 1-day lecture series by NETZSCH experts on:
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Understanding Thermophysical Properties -
Laser Flash Diffusivity, Thermal Conductivity, Thermal Expansion & Specific Heat
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Advanced Applications in Thermal Analysis incl. Coupled FTIR & MS
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Using Adiabatic Calorimetry for Process Safety Studies
This seminar will help you answer the following challenging questions about thermal properties:
 

What are the basics of TGA and DSC and what information can they provide me about my material performance?

How would the technique of STA (SimultaneousDSC-TGA) be helpful to me?

Which evolved gas analysis technique is more useful for coupling to my TGA or STA– FTIR or MS?

How can an Adiabatic Calorimeter be used to identify potential process safety hazards?

What’s new in reaction calorimetry measurements?

Which thermal expansion measurement technique is the right one for my sample?

What is the right approach to measuring thermal conductivity of my material?

   
Seminar Goals
 

Modern thermo-analytical methods are an excellent tool for answering questions such as these in product development, quality control & assurance, failure analysis and research of new products. These methods are even more powerful when coupled to other techniques.  The goal of the seminar is to demonstrate the capabilities of these methods with real life applications from the fields of thermoplastics, thermosets, ceramics, advanced materials, and more.

Because of their technical, non-commercial content, our seminars have become very highly regarded. We hope that you will be able to attend one of these seminars to learn more about material characterization.

 

Preliminary Agenda
 
8:45 a.m - 9:15 a.m. Arrival & ContinentalBreakfast
9:15 a.m. - 9:45 a.m. Welcome & Overview of the NETZSCH Program

9:45 a.m. - 10:40 a.m. Introduction of Classical Thermal Analysis Methods – DSC, TGA & STA

10:40 a.m. – 11:00 a.m. BREAK

11:00 a.m. - 11:45 a.m. Principles of Coupling Methods –TGA- MS & TGA-FTIR – for Evolved Gas Analysis

11:45 p.m. - 12:15 p.m. Thermal Expansion Methods – TMA & Dilatometry

12:15 p.m. - 1:30 p.m Lunch Provided

1:30 p.m. - 2:00 p.m Introduction to Adiabatic Reaction Calorimetry Methods for Thermal Hazard Screening & Safety Assessment

2:00 p.m. - 3:00 p.m. Thermal Conductivity & Diffusivity – Comparison of Transient & Steady State Techniques

3:00 p.m. - 3:15 p.m. Wrap Up & Discussion

 

   
  dates & locations
 
One Day Seminars
April 27 (Tues) Burlington, MA (NETZSCH Headquarters)
April 29 (Thurs)
Montreal, Canada
May 4 (Tues)
Edmonton, Canada
May 6 (Thurs)
Salt Lake City, UT
May 11 (Tues)
San Francisco Bay Area
May 13 (Thurs)
Los Angeles Area
June 8 (Tues)
Cleveland, OH
June 10 (Thurs)
Columbus, OH
June 11 (Fri)
Dayton, OH
June 15 (Tues)
Indianapolis, IN
June 17 (Thurs) St. Louis, MO


 

SEMINAR DETAILS 

Click here for a registration form and to see sample agenda

Seminar cost is $45 for advanced registration; $95 for on-site registration.

Registration Fee includes class notes, breakfast, and lunch

 

 

  registration
 

 

REGISTER NOW! Space is limited - so please register soon to be sure not to miss this unique and informative opportunity.

For further registration details, please contact:

Isabel Day-Jones
Phone: 610-644-4445
Email: isabel.day-jones@netzsch.com

We look forward to welcoming you to the NETZSCH seminar!

 
 


REGISTER NOW!  Space is very limited to 20 attendees per session!



NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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Last update: 02/18/2010 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH