The OnSet editorial staff is pleased to
now present you with Thermal Analysis news, facts and professional
solutions in either printed form or as a pdf-file. Our customer
newspaper, the “OnSet”, has just undergone a complete
makeover and is now more comprehensive than ever.
Some topics are “DEA and kinetic analysis for control of the
curing of chip adhesives” by Dr. Harald Preu of Infineon Technologies
AG, “Heat transfer analysis in layer structures” by Dr.
Jürgen Blumm of the NETZSCH Applications Laboratory, and “Tips & Tricks
for dealing with thermocouples of platinum-platinum/rhodium” by
Dr. Gabriele Kaiser, Director of our Training Department.
Download the OnSet as a pdf-file from the Literature service
or ask about the printed version. We would be very pleased
to hear
your
feedback.
In this Issue
DEA and kinetic analysis for
control of the curing of chip adhesives
NETZSCH offers
precision thermal analysis instruments including advanced dilatometers (with
a new basic R&D/QC dilatometer),
classical DSC & TGA (with
a new economical DSC), high temperature DSC
to 1650°C for specific heat, very high temperature STA
(TGA-DSC/DTA) to 2400°C (featuring the new STA
409-PC Luxx®), thermal
/ evolved gas analysis with fully-integrated FTIR & MS, plus
high resolution TMA and DMA.
We also feature leading technology for thermal conductivity and diffusivity measurement
as well as refractories testing including HMOR, CIC, and RUL.
