NETZSCH
guarded heat flow meters permit testing of materials of moderate
thermal
conductivity such as plastics, epoxies and glass. All
models test solid and thin sheet materials. Optional cells are
available
for testing pastes, powders and polymers through the melt.
All
models conform to ASTM F433 and E1530
Small
sample size
Sub-ambient
testing optional
Optional
PC interface
Principle
of operation
The
user measures the thickness of the test sample and places it between
two heated plates controlled at different temperatures. Thermocouples
just below the plate surfaces measure the temperature drop across
the sample. A heat flux transducer mounted on the cold plate measures
a voltage which is proportional to the heat flow through the sample.
Steady thermocouple and transducer readings indicate thermal equilibrium.
Readings are recorded and the instrument is ready to begin a test
at a new temperature.
The
instrument is calibrated with materials of known thermal conductivity.
This establishes a relation between the voltage signal of the transducer
and the heat flow through it. Thermal conductivity is calculated
from the calibration data, the sample thickness and the temperature
drop across the sample.
Technical
specifications
TCA-446/1/m
TCA-446/1
TCA-446/2
TCA-446/3
Sample
Size
50
mm dia x 0.1 to 20 mm thick
Thermal
Conductivity
Range
0.1
to 10 W/mK
Mean
Sample
Temperature range
40
to 200 ¡C
-150
to 200 ¡C
-150
to 250¡C
40
to 300¡C
Accuracy
Rs=0.005-0.05 m2K/W
Rs=0.002-0.005 m2K/W
+ / - 4 %
+ / - 5 to 10%
Dimensions
L x W x H
50
x 60 x 25 cm3
55
x 65 x 100 cm3
55
x 65 x 100 cm3
25x
60 x 45 cm3
NETZSCH offers
precision thermal analysis instruments including advanced dilatometers (with
a new basic R&D/QC dilatometer),
classical DSC & TGA (with
a new economical DSC), high temperature DSC
to 1650°C for specific heat, very high temperature STA
(TGA-DSC/DTA) to 2400°C (featuring the new STA
409-PC Luxx®), thermal
/ evolved gas analysis with fully-integrated FTIR & MS, plus
high resolution TMA and DMA.
We also feature leading technology for thermal conductivity and diffusivity measurement
as well as refractories testing including HMOR, CIC, and RUL.
