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Dilatometer
DIL 402 PC
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| Knowledge of the thermal behavior is critical to material development and design in every modern industry. |
| Accurate and efficient measurement of the thermophysical properties, however, requires state-of-the-art instrumentation such as that produced by NETZSCH. |
| The DSC 404 C Pegasus®, LFA 427, LFA 457, DIL 402 C/PC, STA 409 PC, STA 449 C, TCT 426 and HFM 436 form the core of the NETZSCH Thermophysical Properties Series instruments. Properties such as thermal diffusivity, thermal conductivity, specific heat, transformation, enthalpies and temperatures, linear and volumetric thermal expansion, bulk density, mass change, etc. can be quickly and accurately determined using these instruments. |
PC Series Instruments |
| The DIL 402 PC is part of the NETZSCH PC product line, specially tailored to the needs of glass and ceramic industries. This additionally includes the Simultaneous Thermal Analyzer STA 409 PC Luxx® (meas-urement of mass changes and transformation energetics), the DTA 404 PC Eos, the Glaze Stress Tester GST 420 PC and Bending Strength Tester BST 401. Please refer to the relevant brochures. |
NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development. Information
Request Form Last update:
05/27/2009
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