NETZSCH - Leading Thermal Analysis.
 
 
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  Applications of Thermokinetics

 
 


  Differential Scanning Calorimetry

   

- Curing of epoxy resin 
-
Curing of epoxy resin with partial diffusion control 
-
Cross linking of powder paint
- Curing of electro-deposition paint
  

 


  Thermogravimetry

   

- Burnout of polymeric binder
-
Decomposition of glucose 
- Thermal decomposition of poly
  (diphenoxyphenyl-phenylenvinylene)

 


  Dilatometry

   

- Simulation of sintering behavior of Al2O
-
Sintering of Si3N4  

 


  Rheometry/Vulcametry

   

- Vulcanization of natural rubber
- Vulcanization including marching modulus and reversion
-
Cross linking of powder paint

 

 


NETZSCH offers precision thermal analysis instruments including advanced dilatometers (with a new basic R&D/QC dilatometer), classical DSC & TGA (with a new economical DSC), high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) to 2400°C (featuring the new STA 409-PC Luxx®), thermal / evolved gas analysis with fully-integrated FTIR & MS, plus high resolution TMA and DMA. We also feature leading technology for thermal conductivity and diffusivity measurement as well as refractories testing including HMOR, CIC, and RUL.

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Last update: 06/16/2008 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH